Encapsulation Process Engineer - 海擎科技有限公司｜Meet.jobs

The job responsibilities:

1. Serving as the company's interface for external encapsulation technology discussions, handling communication with external encapsulation vendors, and confirming encapsulation documentation.

2. Managing suppliers to improve production yield and identify root causes of deviations.

3. Responsibly addressing on-site process anomalies, identifying effective improvement measures, and promptly providing feedback on the resolution of significant issues.

4. Continuously improving various processes, including increasing yield and efficiency.

5. Evaluating, validating, and implementing new equipment, materials, and processes.

6. Compiling and enhancing documentation related to process engineering.

The qualifications and requirements for this position include:

1. Bachelor's degree or higher in a relevant STEM field such as electronic encapsulation technology, microelectronics, materials, electrical engineering, etc.

2. Familiarity with CSP (Chip Scale Package) encapsulation processes and a minimum of 3 years of experience in the industry.

3. Possession of an English Level 4 certificate, enabling daily communication and exchanges.

4. Strong communication and coordination skills.

5. Proficiency in SPC (Statistical Process Control) and various reliability conditions and specifications, with a strong emphasis on quality awareness and familiarity with quality methods and tools.

6. A strong desire for continuous learning, good questioning skills, excellent teamwork, and interpersonal communication abilities, along with the ability to handle significant work pressure.