Engineer - DOCTECH HK LIMITED|Meet.jobs

薪資

18k+ HKD Monthly

技能需求

    工作機會描述

    Role Overview

    We are hiring an Engineer to support research and development project execution and technical development. The Engineer will carry out hands-on experimental work, support data analysis and documentation, and execute research and development project work, contributing to meeting deliverables on schedule and achieving project milestones.

    Key Responsibilities

    • Execute research and development experiments related to electroplating, surface treatment, and semiconductor materials
    • Support process development activities, including parameter optimization, repeatability improvement, and troubleshooting
    • Prepare samples and assist with materials characterization and basic data interpretation
    • Maintain clear experiment records, organize data, and support preparation of technical reports and documentation
    • Coordinate with team members to ensure tasks and deliverables are completed on time
    • Support laboratory operation, including materials preparation, equipment readiness, and compliance with safety procedures
    • Perform other research and development duties as assigned to support project objectives

    Requirements

    • Education level: Fresh PhD degree, or Master’s degree with more than 2 years of related experience
    • Hands-on laboratory experience and strong execution discipline
    • Ability to follow experimental plans, maintain detailed records, and report results clearly
    • Strong problem-solving mindset and willingness to learn in a fast-paced research environment
    • Good communication skills and ability to work effectively with cross-functional teams
    • Experience in electroplating, electrochemistry, surface engineering, or semiconductor materials
    • Familiarity with advanced packaging and interconnect topics (for example, copper electroplating, copper-to-copper bonding, redistribution layer, through-glass via, through-silicon via, copper foils)
    • Experience with structured experiment planning and data-driven optimization

    DOCTECH HK LIMITED

    We are Doctech HK Ltd, developing on the different hybrid copper material, especially for the applications of the future three-dimensional integrated circuit (3DIC) packaging.

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