DOCTECH HK LIMITED｜Meet.jobs
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We are Doctech HK Ltd, developing on the different hybrid copper material, especially for the applications of the future three-dimensional integrated circuit (3DIC) packaging.
Welcome! We are Doctech HK Ltd, a spin-off company from the University of Hong Kong supported by Technology Start-up Support Scheme for Universities (TSSSU). We focus on the development of different hybrid copper material, especially for the applications of the future three-dimensional integrated circuit (3DIC) packaging. We are now recruiting a highly motivated and R&D focused individual to fill an open position of a Postdoctoral Fellow, located in Hong Kong.